Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
Electronic insulation materials are mainly used for insulation protection of semiconductor components and their electronic equipment. 1 printed circuit board, that is, copper foil version. The substrate is a resin laminate, which is called a rigid copper-clad foil plate. It is usually made of a resin plate such as epoxy or phenolic. If the substrate is a polymer film or a single-layer heat-resistant glass varnish, it is called a flexible copper-clad plate. Polyester, polyimide, and fluoropolymer films are often used. 2 packaging materials to prevent the influence of external moisture and impurities on the parameters of semiconductor components. Currently, approximately 90% of semiconductor components are packaged in plastic. Epoxy resin and silicone resin are mainly used, followed by phenolic resin, polyester, polybutadiene and the like. 3 Insulation film for semiconductor devices, surface protection film for semiconductor components such as large-size film integrated circuits (including contact coating film, passivation film, moisture-proof and anti-vibration film, α-ray shielding film for preventing soft errors, etc.) and interlayer insulating film . Such as a polyimide-based aromatic heterocyclic polymer.Disposable Vape, Electronic Cigarettes, vape
November 21, 2024
November 19, 2024
July 19, 2024
July 19, 2024
この仕入先にメール
November 21, 2024
November 19, 2024
July 19, 2024
July 19, 2024
Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
Fill in more information so that we can get in touch with you faster
Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.